Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 279-284

  Xie, Ling ^a   Choi, Won Kyoung ^a   Premachandran, C S ^a   Selvanayagam, Cheryl S ^a   Bai, Ke Wu ^b   Zeng, Ying Zhi ^b   Ong, Siong Chiew ^a   Liao, Ebin ^a   Khairyanto, Ahmad ^a   Sekhar, V N ^a   Thew, Serene ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING METHODS; COMPOSITIONAL STRUCTURE; CROSS-SECTIONAL STRUCTURES; DAISY CHAIN STRUCTURE; EDX ANALYSIS; LOW TEMPERATURE SOLDERS; LOW TEMPERATURES; MECHANICAL SIMULATIONS; PHASE CHANGE; RELIABILITY TEST; RESISTANCE INCREASE; SOLDER MATERIAL; TEST VEHICLE; THERMAL CYCLE TESTS; THREE-LAYER; TLP BONDING;

OPTIMIZATION; SHEAR STRENGTH; SOLDERING ALLOYS; STRESSES; THREE DIMENSIONAL;

TEMPERATURE;

EID: 79960397188     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898526     Document Type: Conference Paper

References (10)

1. 2010 2nd IEEE International Workshop on Low Temperature Bonding for 3D Integration.
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3. K. Sakuma et al.", 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections", Proceedings of the 57th Electronic Components and Technology Conference, (2007), pp 627-632.
4. S. Wakiyama et al., "Novel Low-Temperature CoC Interconnection Technology for Multichip LSI (MCL)", Proceedings of the 57th Electronic Components and Technology Conference, (2007), pp. 610-615.
5. Won Kyoung Choi, C. S. Premachandran, Ong Siong Chiew, Xie Ling, Liao Ebin, Ahmad Khairyanto, "Development of Novel Intermetallic Joints using Thin Film Indium Based Solder by Low Temperature Bonding Technology for 3D IC Stacking", Proceedings of the 59th Electronic Components and Technology Conference (2009), pp. 333-338.
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7. A. Prince, G. V. Raynor and D. S. Evans, Phase Diagrams of Ternary Gold Alloys, The Institute of Metals, London (1990).
8. Cheng K. Saw, et al, "Thermal Expansion of AuIn2", Scripta Materiala 53, (2005), 1153-1157.
9. Won Kyoung Choi, C. S. Premachandran, Ling Xie, Siong Chiew Ong, Johnny Han He, Guan Jie Yap, Aibin Yu, "A Novel Die to Wafer (D2W) Collective Bonding Method for MEMS and Electronics Heterogeneous 3D Integration", Proceedings of the 60th Electronic Components and Technology Conference (2010), pp. 829-833.
10. Won Kyoung Choi, Daquan Yu, "Development of Low Temperature Bonding Using In-based Solders", Proceedings of the 58th Electronic Components and Technology Conference (2008), pp 1294-1299.