Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultra thin device

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1276-1282

  Zhang, Xiaowu ^a   Rajoo, Ranjan ^a   Selvanayagam, Cheryl S ^a   Kumar, Aditya ^a   Rao, Vempati Srinivasa ^a   Khan, Navas ^a   Kripesh, V ^a   Lau, John H ^a   Kwong, D L ^a   Sundaram, V ^b   Tummula, Rao R ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-LEVEL; DEVICE WAFERS; DIE CRACKING; DROP IMPACT; DROP TEST; ELECTRONIC PACKAGE; GROWING DEMAND; HAND HELD DEVICE; IN-PLANE STRESS; P-TYPE; PACKAGING PROCESS; PB FREE SOLDERS; PIEZORESISTIVE COEFFICIENTS; PIEZORESISTIVE STRESS SENSORS; PROCESS SELECTION; SILICON DEVICES; SOLDER BUMPING; STRESS EVALUATIONS; ULTRA THIN DIES; ULTRA-THIN; UNDER BUMP METALLIZATION; WAFER BUMPING;

DIES; DROPS; LEAD; PACKAGING; SEMICONDUCTING SILICON COMPOUNDS; SENSORS; SILICON WAFERS; SOLDERING; SOLDERING ALLOYS; STRESS MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 79960387139     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898675     Document Type: Conference Paper

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