The most cost-effective integrator (TSV interposer) for 3D IC integration system-in-package (SiP)

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 1, Issue , 2011, Pages 53-63

  Lau, John H ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

SYSTEM-IN-PACKAGE;

COST EFFECTIVENESS; EXHIBITIONS; INTEGRATION; INTERNET PROTOCOLS;

THREE DIMENSIONAL;

EID: 84860350799     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52189     Document Type: Conference Paper

References (159)

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31. Accepted for IEEE Transactions on Components and Packaging Technologies.
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