Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 285-290

  Banijamali, Bahareh ^a   Ramalingam, Suresh ^a   Nagarajan, Kumar ^a   Chaware, Raghu ^a  

^a XILINX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE DEVICES; ASSEMBLY PROCESS; ELECTRICAL PERFORMANCE; FABRICATION PROCESS; HIGH RELIABILITY; LEAD-FREE; MATERIAL SELECTION; MICRO-BUMPS; MODELING AND SIMULATION; MOISTURE SENSITIVITY; OPTIMIZE DESIGN; ORGANIC SUBSTRATE; PACKAGED DEVICE; PROCESS TECHNOLOGIES; TEST CHIPS; THROUGH-SILICON-VIA; WARPAGES; WIRING DENSITY;

CRACK DETECTION; DIES; OPTIMIZATION; RELIABILITY; THREE DIMENSIONAL;

TECHNOLOGY;

EID: 79960389592     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898527     Document Type: Conference Paper

References (12)

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