A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 314-318

  Premachandran, C S ^a   Lau, John ^a   Ling, Xie ^a   Khairyanto, Ahmad ^a   Chen, Kelvin ^a   Pa, Myo Ei Pa ^a   Chew, Michelle ^a   Won, Kyoung Choi ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONIC EQUIPMENT MANUFACTURE; MEMS; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS; WAFER BONDING;

CHIP SIZES; MEMS DEVICES; NON UNIFORM;

ELECTRONICS PACKAGING;

EID: 51449095637     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549988     Document Type: Conference Paper

References (6)

1. C.S.Premachandran, etal. " A vertical wafer level packaging using through hole filled via by liftoff polymer method for MEMS and 3D stack application" ECTC May 2005, Las Vegas USA
2. C.S.Premachandran, Rang Nathan N, Chen Yu and SC Chong "A novel electrically conductive wafer through hole filled vias interconnect formation for 3D MEMS packaging" ECTC May 2003,USA
3. Gary Li, Ampere A Tsang "Low stress packaging of a micro machined accelerometer" IEEE transactions on electronics packaging manufacturing, Vol.24,No.1, January 2001
4. R.Gooch etal "Wafer level vacuum packaging for MEMS"Journal of vacuum science and Technology A: Vacuum, surface and Films-July 1999-Vol 17, Issue 4.pp 2295-99
5. Marg Wagner ,Jin Zou " Method for creating Low cost 3D MEMS Chemical sensors by using Through wafer via and wafer bonding" ECTC ,June 2007
6. Suk-Jin Ham etal. "Characterization and reliability of Verification of Wafer level hermetic package with nano liter cavity for RF MEMS applications" ECTC, June 2007 USA.