Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 7-13

  Sakuma, K ^a   Toriyama, K ^a   Noma, H ^a   Sueoka, K ^a   Unami, N ^b   Mizuno, J ^b   Shoji, S ^b   Orii, Y ^a  

^a IBM RESEARCH TOKYO   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; AR PLASMAS; AUGER ELECTRON; BONDING STRENGTH; FLUXLESS BONDING; HYDROGEN RADICAL; HYDROGEN RADICAL TREATMENT; ION BEAM SCANNING; MICRO-BUMPS; ORGANIC CONTAMINANT; SCANNING ELECTRON MICROSCOPES; TARGET MATERIALS; TIME OF FLIGHT SECONDARY ION MASS SPECTROMETRY; VACUUM ULTRAVIOLETS;

FORMIC ACID; HYDROGEN; IONS; PHOTOELECTRON SPECTROSCOPY; RATING; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SHEAR STRENGTH; SOLDERING ALLOYS; THREE DIMENSIONAL; X RAY PHOTOELECTRON SPECTROSCOPY;

TIN;

EID: 79960418228     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898483     Document Type: Conference Paper

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