Glass panel processing for electrical and optical packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 625-633

  Schröder, Henning ^a   Brusberg, Lars ^a   Arndt Staufenbiel, Norbert ^b   Hofmann, Jens ^b   Marx, Sebastian ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BASE MATERIAL; BEAM PROPAGATION; CHIP-LEVEL; GLASS PANELS; ION-EXCHANGE TECHNOLOGY; MULTIMODES; ON-WAFER; OPTICAL PACKAGING; PHOTONIC PACKAGING; SUBSTRATE MATERIAL; SYSTEM-IN-PACKAGE; THIN GLASS; THIN GLASS SUBSTRATES; UPSCALING;

CHIP SCALE PACKAGES; GLASS; ION EXCHANGE; SUBSTRATES;

PACKAGING;

EID: 79960397176     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898578     Document Type: Conference Paper

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