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Volumn , Issue , 2008, Pages 367-372
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Process development and reliability of microbumps
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Author keywords
[No Author keywords available]
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Indexed keywords
ALIGNMENT ACCURACIES;
ASSEMBLY COSTS;
ASSEMBLY PARAMETERS;
ASSEMBLY PROCESS;
AU-SN SOLDERS;
BOND FORCES;
BONDING PRESSURES;
DESIGN-OF-EXPERIMENTS;
FINE PITCHES;
FLIP CHIP BONDINGS;
FLIP CHIP TECHNOLOGIES;
FLIP-CHIP ASSEMBLIES;
FLIP-CHIP PACKAGING;
FLUX-LESS BONDINGS;
FLUXLESS;
MICRO-BUMPS;
PROCESS DEVELOPMENT;
SILICON MODULES;
STACKED MODULES;
BRAZING;
CHIP SCALE PACKAGES;
ELECTRONICS INDUSTRY;
FLIP CHIP DEVICES;
MEDICAL APPLICATIONS;
PASSIVATION;
RELIABILITY;
TECHNOLOGY;
TIN ALLOYS;
WELDING;
ELECTRONIC EQUIPMENT MANUFACTURE;
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EID: 63049096701
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2008.4763462 Document Type: Conference Paper |
Times cited : (10)
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References (5)
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