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Volumn , Issue , 2008, Pages 367-372

Process development and reliability of microbumps

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT ACCURACIES; ASSEMBLY COSTS; ASSEMBLY PARAMETERS; ASSEMBLY PROCESS; AU-SN SOLDERS; BOND FORCES; BONDING PRESSURES; DESIGN-OF-EXPERIMENTS; FINE PITCHES; FLIP CHIP BONDINGS; FLIP CHIP TECHNOLOGIES; FLIP-CHIP ASSEMBLIES; FLIP-CHIP PACKAGING; FLUX-LESS BONDINGS; FLUXLESS; MICRO-BUMPS; PROCESS DEVELOPMENT; SILICON MODULES; STACKED MODULES;

EID: 63049096701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763462     Document Type: Conference Paper
Times cited : (10)

References (5)
  • 1
    • 0038819080 scopus 로고    scopus 로고
    • An Investigation Into the Effects of Flux Residues on Properties of Underfill Materials for Flip Chip Packages
    • Fan Zhang, Ming Li, William T. Chen, K.S Chan, "An Investigation Into the Effects of Flux Residues on Properties of Underfill Materials for Flip Chip Packages," IEEE Transaction on Components and Packaging Technologies, Vol. 26, No. 1 (2003), pp. 233-237.
    • (2003) IEEE Transaction on Components and Packaging Technologies , vol.26 , Issue.1 , pp. 233-237
    • Zhang, F.1    Li, M.2    William, T.3    Chen4    Chan, K.S.5
  • 2
    • 0030104263 scopus 로고    scopus 로고
    • Reliability Investigation of Fluxless Flip-Chip Interconnections on Green Tape Ceramic Substrates
    • Joachim Kloeser, Elke Zakel, Franz Bechtold, Herbert Reichl, "Reliability Investigation of Fluxless Flip-Chip Interconnections on Green Tape Ceramic Substrates," IEEE Trans-CPMT-A, Vol. 19, No. 1 (1996), pp. 24-33.
    • (1996) IEEE Trans-CPMT-A , vol.19 , Issue.1 , pp. 24-33
    • Kloeser, J.1    Zakel, E.2    Bechtold, F.3    Reichl, H.4
  • 5
    • 0029305656 scopus 로고
    • Reliable Au-Sn Flip-Chip Bonding on Flexible Prints
    • Antal F.J Baggerman, Martin J. Batenburg, "Reliable Au-Sn Flip-Chip Bonding on Flexible Prints," IEEE Trans-CPMT-B, Vol. 18, No. 2 (1995), pp. 257-263.
    • (1995) IEEE Trans-CPMT-B , vol.18 , Issue.2 , pp. 257-263
    • Baggerman, A.F.J.1    Batenburg, M.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.