A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1126-1129

  Choi, Yongwon ^a   Shin, Jiwon ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; CURING BEHAVIOR; EFFECTS OF MATERIALS; EUTECTIC BONDING; INTERCONNECTION METHOD; JOINT FORMATION; NON-CONDUCTIVE ADHESIVES; POLYMER ADHESIVES; UNDERFILL PROCESS; UNDERFILLS; WAFER LEVEL;

CURING; THREE DIMENSIONAL; WAFER BONDING;

ADHESIVES;

EID: 79960413183     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898651     Document Type: Conference Paper

References (3)

1. R. R. Tummala, Fundamentals of Microsystems Packaging, McGRAW-HILL, 2001.
2. R. R. Tummala, Microelectronics Packaging Handbook, Chapman & Hall, New York, 1997.
3. th International, 2004, p. 64-67.