Chip-to-chip communication by optical routing inside a thin glass substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 805-812

  Brusberg, Lars ^a   Schlepple, Norbert ^a   Schroder, Henning ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLING PROCESS; BEAM COLLIMATION; BOARD-LEVEL; BUILDING BLOCKES; CHIP-TO-CHIP COMMUNICATIONS; FIELD-ASSISTED ION-EXCHANGE; FLIP CHIP; GLASS WAVEGUIDES; GRADIENT INDEX PROFILE; GRADIENT INDEXES; HIGH INTEGRATION DENSITY; INFRARED WAVELENGTHS; INTEGRATION TECHNOLOGIES; ION-EXCHANGE TECHNOLOGY; LOW COUPLING; MODE MATCHING; ON-WAFER; OPTICAL MIRROR; OPTICAL PATHWAYS; OPTICAL ROUTING; OPTICAL SIMULATION; OPTOELECTRONIC COMPONENTS; PACKAGING PROCESS; PHOTONIC INTEGRATED CIRCUITS; POLYMER MATERIALS; POST PROCESS; PROPAGATION LOSS; REFRACTIVE OPTICS; SINGLE MODE; SINGLE MODE WAVEGUIDES; SINGLE-MODE OPTICAL FIBER; THERMAL INSTABILITIES; THIN GLASS; THIN GLASS SHEETS; THIN GLASS SUBSTRATES; WAFER LEVEL; WAVEGUIDE COUPLING; WAVEGUIDE DETECTORS; WAVEGUIDE TECHNOLOGY;

ABLATION; CHIP SCALE PACKAGES; FLIP CHIP DEVICES; GLASS; INTEGRATION; ION EXCHANGE; LENSES; MIRRORS; OPTICAL COMMUNICATION; OPTICAL FIBER COUPLING; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; PHOTONIC DEVICES; SUBSTRATES; TECHNOLOGY; THREE DIMENSIONAL; WAVEGUIDES;

PHOTONIC INTEGRATION TECHNOLOGY;

EID: 79960405108     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898603     Document Type: Conference Paper

References (11)

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