Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 999-1002

  Halder, Sandip ^a   Jourdain, Anne ^a   Claes, Martine ^a   De Wolf, Ingrid ^a   Travaly, Youssef ^a   Beyne, Eric ^a   Swinnen, Bart ^a   Pepper, Valery ^b   Guittet, Pierre Yves ^b   Savage, Greg ^b   Markwort, Lars ^b  

^a IMEC   (Belgium)

^b Nanda Tech Gmbh   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; CHIP STRUCTURES; DEPTH VARIATION; DEVICE WAFERS; GLUE LAYERS; IC MANUFACTURING TECHNOLOGIES; IC TECHNOLOGY; IN-LINE METROLOGY; MAINSTREAM PROCESS; SINGLE CHIPS; VERTICAL DIRECTION; WAFER METROLOGY;

INTEGRATED CIRCUITS; MANUFACTURE; MEASUREMENTS; TECHNOLOGY; THREE DIMENSIONAL; UNITS OF MEASUREMENT;

WAFER BONDING;

EID: 79960415928     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898631     Document Type: Conference Paper

References (5)

1. Proc. of the 1st, 2nd and 3rd conf. on "3D Architectures for Semiconductor Integration and packaging", RTI international, Burlingame, California, April 13-15, 2004; Tempe, Arizona, June 13-15, 2005; Burlingame, California, October 31 - November 2, 2006
2. Beyne, E. "3D Interconnection and packaging: impending reality or still a dream? Proceedings of the IEEE International Solid-State Circuits Conference, ISSCC2004, 15-19 February 2004; San Francisco, CA, USA, IEEE, 2004, pp. 138-145
3. Beyne, E. "System-Driven Approaches to 3D Integration", The 4th International Symposium on Microelectronics and Packaging, Seoul, S-Korea, September 28, 2005, p 25-34.
4. Alapati, R. "TSV Metrology and InspectionChallenges" IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009.
5. De Munck, K. et. al., "Wafer Level Temporary Bonding/Debonding for Thin Wafer Handling Applications", IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, March 2006