-
1
-
-
24644517630
-
Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias
-
Aug.
-
L.W. Schaper, et al., "Architectural Implications and Process Development of 3-D VLSI Z-Axis Interconnects Using Through Silicon Vias," IEEE Trans. Advanced Packaging, Vol. 28, No. 3, pp. 356-366 (Aug. 2005).
-
(2005)
IEEE Trans. Advanced Packaging
, vol.28
, Issue.3
, pp. 356-366
-
-
Schaper, L.W.1
-
2
-
-
0041610704
-
Three-dimensional Integration Technology Based on Wafer Bonding Technique Using Micro-bumps
-
Ext. Abstr. Osaka, Japan, August
-
T. Matsumoto, T. et al., "Three-Dimensional Integration Technology Based on Wafer Bonding Technique Using Micro-Bumps," Ext. Abstr. 1995 Int. Conf. Solid State Devices Mater., Osaka, Japan, August 1995, pp. 1073-1074.
-
(1995)
1995 Int. Conf. Solid State Devices Mater.
, pp. 1073-1074
-
-
Matsumoto, T.1
-
3
-
-
0031270573
-
Three dimensional metallization for vertically integrated circuits
-
P. Ramm, et al., "Three dimensional metallization for vertically integrated circuits," Microelectron. Eng., Vol. 37/38 (1997), pp. 39-47.
-
(1997)
Microelectron. Eng.
, vol.37-38
, pp. 39-47
-
-
Ramm, P.1
-
5
-
-
0043113510
-
128Mbit NAND flash memory by chip-on-chip technology with cu through plug
-
Tokyo, Japan, April
-
K. Sasaki, et al., "128Mbit NAND Flash Memory by Chip-on-Chip Technology with Cu Through Plug," 2001 Int. Conf. Electron. Packaging Proc., Tokyo, Japan, April 2001, pp. 39-43.
-
(2001)
2001 Int. Conf. Electron. Packaging Proc.
, pp. 39-43
-
-
Sasaki, K.1
-
6
-
-
10444221697
-
Process integration of 3D chip stack with vertical interconnection
-
Orlando, FL, June
-
K. Takahashi, et al., "Process Integration of 3D Chip Stack with Vertical Interconnection," Proc. 54th Electron. Components and Technol. Conf., Orlando, FL, June 2004, pp.601-609.
-
(2004)
Proc. 54th Electron. Components and Technol. Conf.
, pp. 601-609
-
-
Takahashi, K.1
-
7
-
-
23844447366
-
Wafer-level 3D interconnects via copper bonding
-
P. Morrow, et al., "Wafer-level 3D Interconnects via Copper Bonding" Conf. Proc. Adv. Metallization Conf. 2004, pp. 125-130, 2004.
-
(2004)
Conf. Proc. Adv. Metallization Conf. 2004
, pp. 125-130
-
-
Morrow, P.1
-
8
-
-
0000983009
-
Thermal response of metals to ultrashort-pulse laser excitation
-
Dec.
-
P. B. Corkum, F. Brunel, N. K. Sherman, and T. Srinivasan-Rao, "Thermal Response of Metals to Ultrashort-Pulse Laser Excitation," Phys. Rev. Lett., Vol. 61, No. 25, pp. 2886-2889, Dec. 1988.
-
(1988)
Phys. Rev. Lett.
, vol.61
, Issue.25
, pp. 2886-2889
-
-
Corkum, P.B.1
Brunel, F.2
Sherman, N.K.3
Srinivasan-Rao, T.4
-
9
-
-
36448999056
-
Laser-cleaning techniques for removal of surface particles
-
Apr.
-
A. C. Tam, W. P. Leung, W. Zepka and W. Ziemlich, "Laser-cleaning techniques for removal of surface particles," J. Appl. Phys., Vol. 71, No. 7, pp. 3515-3523, Apr. 1992.
-
(1992)
J. Appl. Phys.
, vol.71
, Issue.7
, pp. 3515-3523
-
-
Tam, A.C.1
Leung, W.P.2
Zepka, W.3
Ziemlich, W.4
|