How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 989-998

  Tsai, W L ^a   Chang, H H ^a   Chien, C H ^a   Lau, J H ^a   Fu, H C ^a   Chiang, C W ^a   Kuo, T Y ^a   Chen, Y H ^a   Lo, R ^a   Kao, M J ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

300MM WAFER; ADHESIVE MATERIALS; BENDING STIFFNESS; BLANKET WAFERS; CRITICAL STEPS; DIFFERENT STRUCTURE; IN-VACUUM; MICRO-BUMPS; PACKAGING ASSEMBLIES; PROCESS GUIDELINES; SEMI-CONDUCTOR FABRICATION; SOLDER BUMP; THIN WAFERS; WAFER THINNING;

CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; MATERIALS HANDLING; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON WAFERS;

WAFER BONDING;

EID: 79960423089     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898630     Document Type: Conference Paper

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