Evaluation of surface microroughness for surface activated bonding

2010 IEEE CPMT Symposium Japan, ICSJ10

Volumn , Issue , 2010, Pages

  Tsukamoto, Kei ^a   Higurashi, Eiji ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EVALUATION OF SURFACE ROUGHNESS; POWER SPECTRAL DENSITY FUNCTION; ROOT MEAN SQUARE; SURFACE ACTIVATED BONDING; SURFACE FLATNESS; SURFACE MICROROUGHNESS;

METAL CLADDING; POWER SPECTRAL DENSITY; SURFACE PROPERTIES; SURFACE ROUGHNESS;

NUMERICAL METHODS;

EID: 79251541211     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CPMTSYMPJ.2010.5679979     Document Type: Conference Paper

References (5)

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3. S. Higashino and T. Suga, Effect of Surface Roughness on Low Temperature Bonding of Au Sputtered Films (2008)
4. C. Ruppe and A. Duparre, Roughness analysis of optical films and substrates by atomic force microscopy, Thin Solid Films 288 (1996) 8-13 (Pubitemid 126390936)
5. I. Horcas, R. Fernandez,J.M. Gomez-Rodriguez, J. Colchero, J. Gomez-Herrero and A. M. Baro, Rev. Sci. Instrum. 78 , 013705 (2007)