Electrical design of a cost-effective thermal enhanced plastic ball grid array package - NuBGA

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 35-41

  Lau, John H ^a,b   Chou, Tai Yu ^a,c  

^a IEEE   (United States)

^b Express Packaging Systems Inc   (United States)

^c SUN MICROSYSTEMS   (United States)

Author keywords

Cost effective; Electrical enhanced; NuBGA; PBGA; SVC; SWA

Indexed keywords

COST EFFECTIVENESS; ELECTRIC PROPERTIES; ELECTRIC VARIABLES MEASUREMENT; HEAT EXCHANGERS; PLASTIC PRODUCTS; PRINTED CIRCUIT MANUFACTURE;

PLASTIC BALL GRID ARRAY (PBGA) PACKAGE; SPLIT VIA CONNECTION (SVA) DESIGN; SPLIT WRAP AROUND (SWA) DESIGN;

ELECTRONICS PACKAGING;

EID: 0031996741     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659504     Document Type: Article

References (17)

1. C. P. Wong, Polymers for Electronic and Photonic Applications. San Diego, CA: Academic, 1993.
2. R. Senthinathan and J. L. Prince, Simultaneous Switching Noise of CMOS Devices and Systems. New York: Kluwer, 1994.
3. R. R. Tummala and E. Rymaszewski, Microelectronics Packaging Handbook. New York: Van Nostrand Reinhold, 1989.
4. D. P. Seraphim, R. Lasky, and C. Y. Li, Principles of Electronic Packaging. New York: McGraw-Hill, 1989.
5. J. H. Lau, "Electronics packaging technology update: BGA, CSP, DCA, and flip chip," Circuit World, vol. 23, no. 4, pp. 22-25, 1997.
6. J. H. Lau and Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. New York: McGraw-Hill, 1997.
7. J. H. Lau, Flip Chip Technologies. New York: McGraw-Hill, 1996.
8. _, Ball Grid Technology. New York: McGraw-Hill, 1995.
9. _, Chip On Board Technologies for Multichip Modules. New York: Van Nostrand Reinhold, 1994.
10. _, Handbook of Fine Pitch Surface Mount Technology. New York: Van Nostrand Reinhold, 1994.
11. J. H. Lau, C. P. Wong, J. Prince, and W. Nakayama, Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998.
12. J. H. Lau, Thermal Stress and Strain in Microelectronics Packaging. New York: Van Nostrand Reinhold, 1993.
13. _, Handbook of Tape Automated Bonding. New York: Van Nostrand Reinhold, 1992.
14. _, Solder Joint Reliability, Theory and Applications. New York: Van Nostrand Reinhold, 1991.
15. _, "Solder joint reliability of a low cost chip size package-NuCSP," in Proc. ISHM'77 Int. Symp. Microelectron., 1977, pp. 691-696.
16. J. H. Lau and T. Chen, "Cooling assessment and distribution of heat dissipation of a cavity down plastic ball grid array package-NuBGA," in Proc. ISHM'77 Int. Symp. Microelectron., 1977, pp. 482-493.
17. Tektronix, TDR Tools in Modeling Interconnects and Packages, Application Note, Tektronix, Beaverton, OR, 1993.