Full characterization of Cu/Cu direct bonding for 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 219-225

  Taibi, Rachid ^a   Di Cioccio, Léa ^b   Chappaz, Cedrick ^a   Chapelon, Laurent Luc ^a   Gueguen, Pierric ^b   Dechamp, Jérôme ^b   Fortunier, Roland ^c   Clavelier, Laurent ^b  

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; AMBIENT AIR; BONDING INTERFACES; CU LINES; DIRECT BONDING; ELECTRICAL CHARACTERIZATION; HIGH DENSITY; INTERFACE RELIABILITY; ROOM TEMPERATURE; SPECIFIC CONTACT RESISTANCES; WAFER STRUCTURE;

ATMOSPHERIC PRESSURE; THREE DIMENSIONAL;

WAFER BONDING;

EID: 77955211513     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490904     Document Type: Conference Paper

References (7)

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