Carrierless design for handling and processing of ultrathin wafers

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 316-322

  Bieck, Florian ^a   Spiller, Sven ^a   Molina, Froilan ^a   Töpper, Michael ^b   Lopper, Christina ^b   Kuna, Ingrid ^b   Seng, Tan Chuan ^c   Tabuchi, Tomotaka ^d  

^a Doublecheck Semiconductors Pte Ltd   (Singapore)

^b FRAUNHOFER IZM   (Germany)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d Disco HiTech Europe GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BUMPING PROCESS; CARRIER WAFERS; CARRIER-LESS; FULL INTEGRATION; MECHANICAL INTEGRITY; PROCESSING TECHNOLOGIES; THROUGH-SILICON-VIA; ULTRA-THIN;

MECHANICAL STABILITY; SEMICONDUCTING SILICON COMPOUNDS; SYSTEM STABILITY; WAFER BONDING;

SILICON WAFERS;

EID: 77955212796     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490953     Document Type: Conference Paper

References (8)

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