Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1183-1189

  Chen, Zhaohui ^a   Zhou, Shengjun ^a   Lv, Zhicheng ^b,c   Liu, Chuan ^b,c   Chen, Xing ^b,c   Jia, Xiao ^b,c   Zeng, Ke ^b,c   Song, Bin ^b,c   Zhu, Fulong ^b,c   Chen, Mingxiang ^b,c   Wang, Xuefang ^b,c   Zhang, Honghai ^b,c   Liu, Sheng ^a,b,c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; CHEMICAL-MECHANICAL PLANARIZATION; COPPER ELECTROPLATING; ELECTROMIGRATION TESTING; ELECTRONIC DEVICE; EMERGING TRENDS; FORMATION PROCESS; HIGH ASPECT RATIO VIA; HIGH COSTS; HIGH-VOLUME PRODUCTION; IC PACKAGE; INNOVATIVE DESIGN; MANUFACTURING PROCESS; MATERIAL PROPERTY; MATERIAL PROPERTY CHARACTERIZATION; MEMS PACKAGING; MODELING TECHNIQUE; NUMERICAL MODELING; NUMERICAL SIMULATION MODELS; RELIABILITY DESIGN; SUBMICRON; TECHNICAL CHALLENGES; THERMAL MECHANICAL ANALYSIS; THROUGH SILICON VIAS; TIME TO MARKET; TRIAL-AND-ERROR METHOD; VIRTUAL MANUFACTURING; VIRTUAL PROTOTYPING; WAFER THINNING;

AGILE MANUFACTURING SYSTEMS; ASPECT RATIO; COMPUTER SIMULATION; DESIGN; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; INDUSTRIAL APPLICATIONS; INTEGRATION; INTERCONNECTION NETWORKS; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; NUMERICAL METHODS; PACKAGING; PROFITABILITY; SILICON WAFERS; TECHNOLOGY;

RELIABILITY;

EID: 79960385544     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898660     Document Type: Conference Paper

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