A novel moiré fringe assisted method for nanoprecision alignment in wafer bonding

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 872-878

  Wang, Chenxi ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATED CIRCUIT; ALIGNMENT ACCURACY; ALIGNMENT MARKS; ALIGNMENT METHODS; BONDED WAFERS; CENTROSYMMETRIC; HIGH PRECISION; HIGHLY SENSITIVE; MULTILAYER STRUCTURES; NANO-METER-SCALE; NANOPRECISION; ON-WAFER;

INTEGRATED CIRCUITS; WAFER BONDING;

ALIGNMENT;

EID: 70349695860     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074115     Document Type: Conference Paper

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