Cooling assessment and distribution of heat dissipation of a cavity down plastic ball grid array package - NuBGA

International Journal of Microcircuits and Electronic Packaging

Volumn 21, Issue 1, 1998, Pages 109-118

  Lau, John ^a   Chen, Tony ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FINITE ELEMENT METHOD; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; PRINTED CIRCUIT BOARDS; TEMPERATURE DISTRIBUTION; THERMODYNAMIC PROPERTIES;

CAVITY DOWN PLASTIC BALL GRID ARRAY; HEAT SPREADER; NUBGA; THERMAL PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 0032010274     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)