Application of piezoresistive stress sensors in ultra thin device handling and characterization

Sensors and Actuators, A: Physical

Volumn 156, Issue 1, 2009, Pages 2-7

  Zhang, Xiaowu ^a   Kumar, Aditya ^a   Zhang, Q X ^a   Ong, Y Y ^a   Ho, S W ^a   Khong, C H ^a   Kripesh, V ^a   Lau, John H ^a   Kwong, D L ^a   Sundaram, V ^b   Tummula, Rao R ^b   Meyer Berg, Georg ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Piezoresistive stress sensors; Stress measurement; Ultra thin device packaging assembly; Wafer thinning and handling

Indexed keywords

DEVICE PACKAGING; PIEZORESISTIVE STRESS SENSORS; ULTRA-THIN; WAFER THINNING; WAFER THINNING AND HANDLING;

INSTRUMENTS; SEMICONDUCTING SILICON COMPOUNDS; SENSORS; SILICON WAFERS; STRESS MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 71649088048     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.01.024     Document Type: Article

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