3D LED and IC wafer level packaging

Microelectronics International

Volumn 27, Issue 2, 2010, Pages 98-105

  Lau, John ^a   Lee, Ricky ^b   Yuen, Matthew ^b   Chan, Philip ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Integrated circuits; Light emitting diodes; Packaging

Indexed keywords

3-D INTEGRATION; A-THERMAL; APPLICATION SPECIFIC; ASSEMBLY PROCESS; DESIGN/METHODOLOGY/APPROACH; FORM FACTORS; IC CHIPS; IC WAFERS; LED DRIVERS; LOWER COST; POWER CONTROLLERS; RADIO FREQUENCIES;

APPROXIMATION THEORY; DIODES; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; LIGHT EMISSION; PACKAGING; THREE DIMENSIONAL;

LIGHT EMITTING DIODES;

EID: 77952599293     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565361011034786     Document Type: Article

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