Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 706-710

  Wei, C C ^a   Yu, C H ^a   Tung, C H ^a   Huang, R Y ^a   Hsieh, C C ^a   Chiu, C C ^a   Hsiao, H Y ^b   Chang, Y W ^b   Lin, C K ^b   Liang, Y C ^b   Chen, C ^b   Yeh, T C ^a   Lin, Larry C ^a   Yu, Doug C H ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT CROWDING; ELECTROMIGRATION BEHAVIOR; EXPERIMENTAL OBSERVATION; FLIP-CHIP PACKAGES; HIGH RELIABILITY; INTERMETALLIC COMPOUND GROWTHS; JOULE HEATING EFFECT; MICRO-BUMPS; MICROELECTRONIC PACKAGING; PB FREE SOLDERS; PROPER DESIGN; RESISTANCE INCREASE; SN GRAINS; SOLDER BUMP; STRESS MODELING; VOID FORMATION;

DISSOLUTION; ELECTROMIGRATION; INTERMETALLICS; LEAD; MICROELECTRONICS; TIN;

SOLDERING ALLOYS;

EID: 79960394102     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898590     Document Type: Conference Paper

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