Power delivery network design for 3D SIP integrated over silicon interposer platform

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1193-1198

  Lee, Heeseok ^a   Choi, Yun Seok ^a   Song, Eunseok ^a   Choi, Kiwon ^a   Cho, Taeje ^a   Kang, Sayoun ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; DATA STORAGE EQUIPMENT; LOGIC CIRCUITS; MULTIMEDIA SERVICES;

POWER DELIVERY NETWORKS; SILICON INTERPOSERS;

CHIP SCALE PACKAGES;

EID: 35348877852     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373945     Document Type: Conference Paper

References (9)

1. Rao R. Tummala, "SOP : What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade," IEEE Trans on Advanced Packaging, vol.27, no.2, Frebruary 2004, pp.241-248
2. Seppo K. Pienimaa and Nigel I. Martin, "High-Density Packaging for Mobile Termainals," IEEE Trans on Advanced Packaging, vol.27, no.3, August 2004, pp.467-475
3. Seppo K. Pienimaa, et al., "Stacked Modular Package," IEEE Trans on Advanced Packaging, vol.27, no.3, August 2004, pp.461-466
4. Seungyoung Ahn, et al, "Over GHz Electrical Circuit Model of a High-Density Multiple Line Grid Array (MLGA) Interposer," IEEE Trans on Advanced Packaging, vol.26, no. 1, February 2003, pp.90-98
5. Pushkar Jain, et al, "Embedded Thin Film Capacitors -Theoretical Limits," IEEE Trans on Advanced Packaging, vol.25, no.3, August 2002.
6. Hyungsoo Kim, et al, "Significant Reduction of Power Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor," IEEE Topical meeting on Electrical Performance of Electronic Packaging, 2003, pp. 129-132
7. Larry D. Smith, et al, "Power Distribution System Design Methodology and Capacitor Selection of Modem CMOS Technology", IEEE Trans. on Advanced Packaging, vol.22, no.3, August 1999.
8. Mahadvan Swaminathan, et al. "Power Distribution Networks for System-on-Package Status and Challenges," IEEE Trans on Advanced Packaging, vol.27, no.2, May 2004, pp.286-300
9. Martin Saint-Laurent and Madhavan Swaminathan, "Impact of Power-Supply Noise on Timing in High-Frequency Microprocessors," IEEE Trans on Advanced Packaging, vol.27, no. 1, Frebruary 2004, pp.135-144