Efficient full-wave modeling of high density TSVs for 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 663-666

  Gu, Xiaoxiong ^a   Wu, Boping ^b   Ritter, Mark ^a   Tsang, Leung ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF WASHINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; COPPER LOSS; CYLINDRICAL WAVE; ELECTRICAL PERFORMANCE; FUNDAMENTAL MODES; GUIDED WAVE; HIGH DENSITY; HIGH ORDER MODE; LAX EQUATION; MULTIPLE SCATTERING TECHNIQUES; NUMERICAL SIMULATION; RETURN LOSS; STRATIFIED MEDIA; T-MATRIX; THROUGH SILICON VIAS; THROUGH-SILICON-VIA; WAVE MODELING;

SILICON COMPOUNDS; THREE DIMENSIONAL; WAVE EQUATIONS;

SILICON OXIDES;

EID: 77955226794     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490794     Document Type: Conference Paper

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