Thermal effects of three dimensional integrated circuit stacks

Proceedings - IEEE International SOI Conference

Volumn , Issue , 2007, Pages 91-92

  Chen, C L ^a   Chen, C K ^a   Bums, J A ^a   Yost, D R ^a   Warner, K ^a   Knecht, J M ^a   Wyatt, P W ^a   Shibles, D A ^a   Keast, C L ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEATING EFFECTS; METAL HEAT SINK; METAL PLUGS; PN DIODES;

ELECTRIC CONNECTORS; HEAT SINKS; SEMICONDUCTOR DIODES; THERMAL EFFECTS; THREE DIMENSIONAL; WSI CIRCUITS;

INTEGRATED CIRCUITS;

EID: 43549095407     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2007.4357867     Document Type: Conference Paper

References (5)

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2. V.W.C. Chan, et al., IEDM Tech. Dig., 2000, pp. 161-164.
3. T. Fukushima, et al., IEDM Tech. Dig., 2005, pp. 359-362.
4. V. Suntharalingam, et al., Proc., IEEE ISSCC, 2002, pp. 356-357.
5. K. Warner, et al., Proc. IEEE InP and Related Materials Conf., 2006, pp. 226-228.