CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1393-1398

  Dang, Bing ^a   Andry, Paul ^a   Tsang, Cornelia ^a   Maria, Joana ^a   Polastre, Robert ^a   Trzcinski, Robert ^a   Prabhakar, Aparna ^a   Knickerbocker, John ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; CLEAN PROCESS; CMOS CIRCUITS; CMOS COMPATIBLE; CMOS PROCESSING; DEBONDING PROCESS; DEVICE WAFERS; HIGH THROUGHPUT; LOW COSTS; PULSED ULTRAVIOLET; THIN WAFERS;

DEBONDING; EXCIMER LASERS; GAS LASERS; PULSED LASERS; THREE DIMENSIONAL; ULTRAVIOLET LASERS;

WAFER BONDING;

EID: 77955180342     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490820     Document Type: Conference Paper

References (13)

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