Processing of ultrathin 300 mm wafers with carrierless technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 984-988

  Spiller, Sven ^a   Molina, Froilan ^a   Wolf, Jürgen M ^b   Grafe, Jurgen ^b   Schenke, Andreas ^b   Toennies, Dietrich ^c   Hennemeyer, Marc ^c   Tabuchi, Tomotaka ^d   Auer, Hans ^e  

^a Doublecheck Semiconductors Pte Ltd   (Singapore)

^b FRAUNHOFER IZM   (Germany)

^c SUSS MicroTec Lithography GmbH   (United States)

^d Disco HiTech Europe GmbH   (Germany)

^e Balzers AG   (Liechtenstein)

Author keywords

[No Author keywords available]

Indexed keywords

300 MM WAFERS; CARRIER-LESS; POWER CHIPS; REDISTRIBUTION LAYERS; THROUGH-SILICON-VIA; ULTRA-THIN; ULTRATHIN SILICON;

MANUFACTURE; SEMICONDUCTING SILICON COMPOUNDS;

SILICON WAFERS;

EID: 79960427716     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898629     Document Type: Conference Paper

References (10)

1. Zoschke, K. et al: "Evaluation of Thin Wafer Processing using a Temporary Wafer Handling System as Key Technology for 3D System Integration", Proc 60th Electronic Components and Technology Conf, Las Vegas, June 2010, pp. 1386-1392.
2. th Electronic Packaging and Technology Conf, Singapore, December 2008, pp. 1301-1305.
3. th Electronic Packaging and Technology Conf, Singapore, December 2008, pp. 45-50.
4. Charbonnier, J et al,: "Integration of a Temporary Carrier in a TSV Process Flow" Proc 59th Electronic Components and Technology Conf, Las Vegas, May 2009, pp. 865-871.
5. th Electronic Packaging and Technology Conf, Singapore, December 2008, pp. 405-411.
6. Spiller, S. M. et al, "Semiconductor Wafer and Producing the Same". WO 2009/141811 A2
7. Spiller, S. M. et al, "Semiconductor Wafer and Producing the Same". WO 2009/141740 A2.
8. Bieck, F. et al, "Carrierless Design for Handling and Processing of Ultrathin Wafers" Proc 60th Electronic Components and Technology Conf, Las Vegas, June 2010, pp. 316-322.
9. Bieck, F. et al, "Integration of Carrierless Ultrathin Wafers into a TSV Process Flow". Proc 12th Electronic Components and Technology Conf, Singapore, December 2010
10. Yoshida et al, "Wafer Grinding Method". US 2008/0090505 A1