Effect of wafer back grinding on the mechanical behavior of multilayered low-k for 3D-stack packaging applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1517-1524

  Sekhar, V N ^a   Shen, Lu ^b   Kumar, Aditya ^a   Chai, T C ^a   Vincent, Lee Wen Sheng ^a   Sandy, Wang Xin Lin ^a   Zhang, Xiaowu ^a   Premchandran, C S ^a   Kripesh, V ^a   Lau, John H ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BORON CARBIDE; CHIP SCALE PACKAGES; COMPUTER NETWORKS; DIAMONDS; ELECTRONIC EQUIPMENT MANUFACTURE; GRINDING (COMMINUTION); GRINDING (MACHINING); MECHANICAL PROPERTIES; NANOINDENTATION;

ELECTRONIC COMPONENTS; FAILURE LOADS; GRINDING PROCESSES;

ELECTRONICS PACKAGING;

EID: 51349133304     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550177     Document Type: Conference Paper

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