Design for plastic ball grid array solder joint reliability

Circuit World

Volumn 23, Issue 2, 1997, Pages

  Lee, S W R ^a   Lau, J H ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; PLASTIC DEFORMATION; PLASTICS APPLICATIONS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; COMPUTATIONAL STRESS ANALYSIS; PLANE STRAIN ELEMENTS; PLASTIC BALL GRID ARRAY; PRINTED CIRCUIT BOARD ASSEMBLY; SOLDER BALL; SOLDER JOINT RELIABILITY;

ELECTRONICS PACKAGING;

EID: 0030734219     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129710370132     Document Type: Article

References (6)

1. Lau,J. H., 'Ball Grid Array Technology',McGraw-Hill, New York (1995).
2. Freyman, B., 'The Next Ten Years of Ball Grid Array Packaging', SMTA Annual Meeting, San Jose, September (1996).
3. Lau, J. H., 'Solder Joint Reliability: Theory and Applications', Van Nostrand Reinhold, New York (1991).
4. Lau, J. H., 'Thermal Stress and Strain in Microelectronics Packaging', Van Nostrand Reinhold, New York (1993).
5. Lau, J. H. and Pao, Y. H., 'Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies', McGraw-Hill, New York (1997).
6. Lee, S-W. R. and Lau, J. H., 'Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Package',Circuit World, Vol.23,No.1,pp. 16-19,October (1996).