IMC bonding for 3D interconnection

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 864-871

  Sakuma, K ^a   Sueoka, K ^a   Kohara, S ^a   Matsumoto, K ^a   Noma, H ^a   Aoki, T ^b   Oyama, Y ^b   Nishiwaki, H ^c   Andry, P S ^d   Tsang, C K ^d   Knickerbocker, J U ^d   Orii, Y ^a  

^a IBM RESEARCH TOKYO   (Japan)

^b IBM   (United States)

^c IBM JAPAN LTD   (Japan)

^d IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ADDITIONAL STRESS; DIE STACK; ELECTRICAL RESISTANCES; INDIUM SOLDERS; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; MECHANICAL SHOCK; MICRO-BUMPS; ORGANIC SUBSTRATE; REFLOW PROCESS; SHEAR TESTING; SHORT CYCLE; SOLDER BALLS; SOLDER VOLUME; STACKED SYSTEMS; TESTING TIME; THERMAL CYCLE; THERMAL CYCLE TESTING; THERMALLY STABLE; THROUGH SILICON VIAS; WORK FOCUS;

DIES; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; METALLURGY; SOLDERING ALLOYS; THERMAL CYCLING; THREE DIMENSIONAL; TUNGSTEN;

SHOCK TESTING;

EID: 77955188792     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490703     Document Type: Conference Paper

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