SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 350-354

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

(14) Yu, Aibin a Lau, John H b Ho, Soon Wee a Kumar, Aditya a Yin, Hnin Wai a Ching, Jong Ming a Kripesh, Vaidyanathan a Pinjala, Damaruganath a Chen, Scott c Chan, Chien Feng c Chao, Chun Chieh c Chiu, Chi Hsin c Huang, Chih Ming c Chen, Carl c

a INSTITUTE OF MICROELECTRONICS (Singapore)

b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Hong Kong)

c SILICONWARE PRECISION INDUSTRIES CO LTD (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINE PITCH; HIGH ASPECT RATIO; HIGH DENSITY; MICRO-BUMPS; SI CHIPS; THREE DIMENSIONAL (3D) INTERCONNECTS; THROUGH SILICON VIAS; UNDER-BUMP METALLURGIES;

NICKEL METALLURGY; PHOTORESISTS; PRESSURE DROP; SILICON; THREE DIMENSIONAL;

ASPECT RATIO;

EID: 70349659227 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2009.5074039 Document Type: Conference Paper

Times cited : (55)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.