Thermal and mechanical evaluations of a cost-effective plastic ball grid array package

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 3, 1997, Pages 208-212

  Lau, J H ^a   Chen, K L ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EPOXY RESINS; FINITE ELEMENT METHOD; HEAT RESISTANCE; MATHEMATICAL MODELS; POLYMERIC GLASS; PRINTED CIRCUIT BOARDS; SUBSTRATES; TEMPERATURE DISTRIBUTION;

EPOXY GLASS; PLASTIC BALL GRID ARRAY (PBGA);

ELECTRONICS PACKAGING;

EID: 0031236461     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792236     Document Type: Article

References (4)

1. ANSYS, 1996, “User’s Manual 5.3” Swanson Analysis Systems, Inc., Houston PA.
2. Gillis J. C., and Kuo, A. Y., 1996, private communication with the authors. Lau, J. H., 1994, “Handbook of Fine Pitch Surface Mount Technology,” Van Nostrand Reinhold, New York, NY.
3. Lau, J. H., 1995, “Ball Grid Array Technology,” McGraw-Hill, New York, NY
4. Lau, J. H., and Pao, Y. H., 1997, “Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies,” McGraw-Hill, New York, NY