Development of fine pitch solder microbumps for 3D chip stacking

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 387-392

  Yu, Aibin ^a   Kumar, Aditya ^a   Ho, Soon Wee ^a   Yin, Hnin Wai ^a   Lau, John H ^a   Houe, Khong Chee ^a   Siang, Sharon Lim Pei ^a   Zhang, Xiaowu ^a   Yu, Da Quan ^a   Su, Nandar ^a   Bi Rong, Michelle Chew ^a   Ching, Jong Ming ^a   Chun, Tan Teck ^a   Kripesh, Vaidyanathan ^a   Lee, Charles ^a   Huang, Jun Pin ^b   Chiang, James ^b   Chen, Scott ^b   Chiu, Chi Hsin ^b   Chan, Chang Yueh ^b   Chang, Chin Huang ^b   Huang, Chih Ming ^b   Hsiao, Cheng Hsu ^b   more..

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BRAZING; CHIP SCALE PACKAGES; NICKEL METALLURGY; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS; TIN; WELDING;

3D STACKING TECHNOLOGIES; BONDING CONDITIONS; CHIP STACKING; ELECTROLESS; FINE PITCHES; FLIP-CHIP BONDERS; HIGH DENSITIES; MICRO-BUMPS; SI CHIPS; ULTRA-FINE PITCHES; UNDER-BUMP METALLURGIES; UNDERFILL MATERIALS; UNDERFILL PROCESS; UNDERFILLING; VOID-FREE; WAFER LEVELS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 63049114343     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763465     Document Type: Conference Paper

References (9)

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