Bumping and stacking processes for 3D IC using fluxfree polymer

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1746-1751

  Choi, Kwang Seong ^a   Sung, Ki Jun ^a   Bae, Hyun Cheol ^a   Moon, Jong Tae ^a   Eom, Yong Sung ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; MASK LESS; PICK AND PLACE; REFLOW PROCESS; SI WAFER; SOLDER BUMP; SOLDER POWDERS; STACKING PROCESS; STANDARD DEVIATION; UNDERFILLS;

SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SOLDERING;

WAFER BONDING;

EID: 79960435960     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898748     Document Type: Conference Paper

References (13)

1. Nowak, M., Plenary Speech, IEEE Internatinal Con. 3D System Integration (2009).
2. th Electronic Components and Technology Conf. 2010, pp. 1399-1403.
3. th Electronic Components and Technology Conf. 2010, pp. 858-863
4. th Electronics Packaging Technology Conf. 2007, pp. 805-810.
5. th Electronics Packaging Technology Conf. 2009, pp. 389.-394.
6. Choi, K.-S. et al, "Novel Maskless Bumping for 3D Integration", ETRI J. Vol. 32, No. 2 (2010), pp. 342-344.
7. Choi, K.-S. et al, "Novel Bumping Material for Solder-on-Pad (SoP) Technology", ETRI. J. accepted.
8. th Int'l Conf. Electronic Packaging Technology & High Density Packaging, 2010, pp. 185-189.
9. Eom, Y. S., et al, "Characterization of Polymer Materix and Low Melting Point Solder for Anisotropic Conductuve Film", Microelectron. Eng., Vol. 85 (2008), pp. 327-331/
10. Eom, Y. S., et al, "Electrical and Mechanical Characterization of Anisotripic Conductive Adhesive with a Low Melting Point Solder", Micrlelectron. Eng., Vol. 85 (2008), pp. 2202-2206.
11. Eom, Y. S., et al, "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder", ETRI J. Vo. 32, No. 3 (2010), pp. 414-421.
12. IPC Std. J-STD-005, Requirements for Soldering Pastes.
13. Zhang, Z. Q., et al, "Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip Chip Applications", IEEE Trans. Components and Packaging Technologies, Vol. 24, No. 1 (2001), pp. 59-66.