Critical issues of TSV and 3D IC integration

Journal of Microelectronics and Electronic Packaging

Volumn 7, Issue 1, 2010, Pages 35-43

  Lau, John H ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

3D IC integration; MEOL; Microbumps; Solder; Thermal management; Thin wafer handling; TSV with RDL

Indexed keywords

INTEGRAL EQUATIONS; INTEGRATION; MICROELECTRONICS; PROGRAMMABLE LOGIC CONTROLLERS; SOLDERING; SYSTEM-IN-PACKAGE; SYSTEM-ON-CHIP; TEMPERATURE CONTROL; TIMING CIRCUITS;

CRITICAL ISSUES; MEOL; MICRO-BUMPS; MICROELECTRONIC INDUSTRY; RESEARCH PROBLEMS; SYSTEM ON CHIPS (SOC); THIN WAFERS; TSV WITH RDL;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 79951902080     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-7.1.35     Document Type: Article

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