AuAu surface-activated bonding and Its application to optical microsensors with 3-D structure

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 15, Issue 5, 2009, Pages 1500-1505

  Higurashi, Eiji ^a   Chino, Daisuke ^b   Suga, Tadatomo ^b   Sawada, Renshi ^c  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c KYUSHU UNIVERSITY   (Japan)

Author keywords

Integrated optics; Low temperature bonding; Microsensors; Optical device fabrication; Plasma applications

Indexed keywords

3-D INTEGRATION; 3D STRUCTURES; BONDING TEMPERATURES; FLIP CHIP; GLASS SUBSTRATES; HYBRID INTEGRATION; LASER DIODES; LOW-TEMPERATURE BONDING; OPTICAL CHIPS; OPTICAL DEVICE FABRICATION; OPTICAL MICRO-SENSOR; SI SUBSTRATES; SURFACE ACTIVATED BONDING; THREE DIMENSIONS;

FABRICATION; INTEGRATED OPTICS; MICROSENSORS; OPTICAL DEVICES; OPTICAL INSTRUMENTS; OPTICAL MATERIALS; PHOTONICS; PLASMA APPLICATIONS; PLASMAS; SEMICONDUCTING SILICON COMPOUNDS; THREE DIMENSIONAL;

GLASS BONDING;

EID: 70350604237     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2009.2020812     Document Type: Conference Paper

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