Effects of TSV (Through Silicon Via) interposer/chip on the thermal performances of 3D IC packaging

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 1, Issue , 2010, Pages 67-74

  Lau, John H ^a   Yue, Tang Gong ^a   Hoe, Germaine Yen Yi ^a   Wu, Zhang Xiao ^a   Chong, Chai Tai ^a   Damaruganath, Pinjala ^a   Vaidyanathan, Kripesh ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN CHARTS; ENGINEERING PRACTICES; EQUIVALENT THERMAL; IC PACKAGING; JUNCTION TEMPERATURES; SYSTEM IN PACKAGE; THERMAL PERFORMANCE; THERMAL RESISTANCE; THROUGH-SILICON-VIA;

ASPECT RATIO; COMPUTATIONAL FLUID DYNAMICS; INTERNET PROTOCOLS; THREE DIMENSIONAL;

FILLED POLYMERS;

EID: 77953741979     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89380     Document Type: Conference Paper

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