Design, manufacturing, and testing of a novel plastic ball grid array package

Journal of Electronics Manufacturing

Volumn 9, Issue 4, 1999, Pages 283-291

  Lau, John ^a   Chang, Chris ^a   Chen, Tony ^a   Chen, Tsung Yuan ^b   Tseng, Tzyy Jang ^b   Cheng, David ^b  

^a Express Packaging Systems Inc   (United States)

^b Kwei Shan Ind Park   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PRINTED CIRCUIT DESIGN; PROCESS ENGINEERING; REFLECTOMETERS; SUBSTRATES; TIME DOMAIN ANALYSIS; WIND TUNNELS;

PLASTIC BALL GRID ARRAYS (PBGA); TIME DOMAIN REFLECTOMETERS (TDR);

ELECTRONICS PACKAGING;

EID: 0033292090     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000209     Document Type: Article

References (11)

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