Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1130-1135

  Hsin, Yu Chen ^a   Chen, Chien Chou ^a   Lau, John H ^a   Tzeng, Pei Jer ^a   Shen, Shang Hung ^a   Hsu, Yi Feng ^a   Chen, Shang Chun ^a   Wn, Chien Ying ^a   Chen, Jui Chin ^a   Ku, Tzu Kun ^a   Kao, Ming Jer ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

300MM WAFER; CROSS SECTION; ETCH RATES; PROCESS GUIDELINES; THROUGH SILICON VIAS;

DESIGN OF EXPERIMENTS; SCANNING ELECTRON MICROSCOPY; SHELLFISH;

SILICON WAFERS;

EID: 79960402544     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898652     Document Type: Conference Paper

References (8)

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