Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 790-797

  Doany, Fuad E ^a   Schow, Clint L ^a   Lee, Benjamin G ^a   Budd, Russell ^a   Baks, Christian ^a   Dangel, Roger ^a   John, Richard ^a   Libsch, Frank ^a   Kash, Jeffrey A ^a   Chan, Benson ^b   Lin, How ^b   Carver, Chase ^b   Huang, Jianzhuang ^b   Berry, Jessie ^b   Bajkowski, David ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Endicott Interconnect Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

20 GB/S; BI-DIRECTIONAL LINKS; BI-DIRECTIONAL TRANSCEIVER; BOARD-LEVEL; DATA RATES; ERROR FREE OPERATIONS; FLIP CHIP; FR-4 BOARDS; LENS ARRAY; ONE LENS; OPTICAL ACCESS; OPTICAL COUPLINGS; OPTICAL DATA; OPTICAL PRINTED CIRCUIT BOARDS; OPTICAL TRANSCEIVERS; ORGANIC CARRIERS; PARALLEL OPTICAL TRANSCEIVERS; PHOTODIODE ARRAYS; POLYMER WAVEGUIDES; RECEIVER CHANNELS; SILICON CARRIERS; TERABIT; THROUGH-SILICON-VIA; TURNING MIRRORS;

DATA TRANSFER; ELECTRONIC DOCUMENT EXCHANGE; ELECTRONICS PACKAGING; FABRICATION; INTEGRATION; LENSES; OPTICAL INTERCONNECTS; OPTICAL SYSTEMS; TRANSCEIVERS; TRANSMITTERS; WAVEGUIDE COMPONENTS;

PRINTED CIRCUIT BOARDS;

EID: 79960397173     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898601     Document Type: Conference Paper

References (9)

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