Wafer-scale 3D integration of silicon-on-insulator RF amplifiers

2009 9th Topical Meeting on Silicon Monolithic Integrated Circuits in RF System, SiRF'09 - Digest of Papers

Volumn , Issue , 2009, Pages 209-212

  Chen, C L ^a   Chen, C K ^a   Yost, D R ^a   Knecht, J M ^a   Wyatt, P W ^a   Burns, J A ^a   Warner, K ^a   Gouker, P M ^a   Healey, P ^a   Wheeler, B ^a   Keast, C L ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

RF amplifiers; SOI; Three dimensional integration

Indexed keywords

3-D INTEGRATION; CIRCUIT PERFORMANCE; DIFFERENT PROCESS; MOSFETS; PASSIVE COMPONENTS; RF AMPLIFIERS; SILICON ON INSULATOR; SILICON-ON-INSULATOR CMOS; SOI; THREE-DIMENSIONAL (3D); THREE-DIMENSIONAL INTEGRATION; WAFER-SCALE 3D INTEGRATION; WAFER-SCALE INTEGRATION;

AMPLIFIERS (ELECTRONIC); MICROSENSORS; MONOLITHIC INTEGRATED CIRCUITS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; THREE DIMENSIONAL;

SILICON ON INSULATOR TECHNOLOGY;

EID: 65949105273     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMIC.2009.4770536     Document Type: Conference Paper

References (6)

1. J. A. Bums, et al., IEEE Trans. Electron Devices, vol.53, no. 10, 2006, pp. 2507-2516.
2. V. Suntharalingam, et al., Tech. Digest, IEEE Solid State Circuits Conf., 2005, pp. 356-357.
3. Q. Gu, Z. et al., Tech. Digest, IEEE Solid State Circuit Conf., 2007, pp. 448-449.
4. C. L. Chen, et al., Proc. IEEE SOI Conf., 2007, pp. 91-92.
5. C. L. Chen, et al., IEEE Electron Device Letters, vol.23, no. 1, 2002, pp. 52-54.
6. C. L. Chen, et at., Proc. IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2006, pp. 320-323.