Electrical, optical and fluidic through-silicon vias for silicon interposer applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1992-1998

  Parekh, Mahavir S ^a   Thadesar, Paragkumar A ^a   Bakir, Muhannad S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; COMMUNICATION BANDWIDTH; DATA CENTERS; HEAT REMOVAL; HIGH MEMORY BANDWIDTH; HIGH PERFORMANCE COMPUTING SYSTEMS; HIGH-SPEED; LOW STRESS; MANY-CORE; MEMORY UNITS; MICROPROCESSOR CORE; MULTI-CORE PROCESSOR; PHOTODEFINABLE POLYMER; POWER DELIVERY; SERVER SYSTEM; SINGLE-STEP; STATE OF THE ART; THROUGH SILICON VIAS; ULTRA-HIGH BANDWIDTH;

BANDWIDTH; CHIP SCALE PACKAGES; COMPUTER SOFTWARE SELECTION AND EVALUATION; ELECTRIC POWER TRANSMISSION; FABRICATION; OPTICAL CABLES; OPTICAL LINKS; POLYMERS; PRINTED CIRCUITS; TELECOMMUNICATION SYSTEMS;

OPTICAL COMMUNICATION;

EID: 79960398260     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898790     Document Type: Conference Paper

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