Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1468-1474

  Lee, Ching Kuan ^a   Chang, Tao Chih ^a   Huang, Yu Jiau ^a   Fu, Huan Chun ^a   Huang, Jui Hsiung ^a   Hsiao, Zhi Cheng ^a   Lau, John H ^a   Ko, Cheng Ta ^a   Cheng, Ren Shin ^a   Chang, Pei Chen ^a   Kao, Kuo Shu ^a   Lu, Yu Lan ^a   Lo, Robert ^a   Kao, M J ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SIZES; ELECTROPLATING TECHNIQUE; HEIGHT VARIATION; LAYER THICKNESS; LEAD FREE SOLDERS; MICRO GAPS; MICRO-BUMPS; MICROBUMPING; RELIABILITY ASSESSMENTS; RELIABILITY TEST; SEM ANALYSIS; SHEAR TESTS; SI WAFER; THERMAL CYCLING TEST; UNDERFILLS;

ELECTROPLATING; RATING; RELIABILITY ANALYSIS; SEMICONDUCTING SILICON COMPOUNDS; SHEAR STRENGTH; SILICON WAFERS; SPECIFICATIONS; TIN; WET ETCHING;

WAFER BONDING;

EID: 79960413132     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898704     Document Type: Conference Paper

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