Advanced solder TSV filling technology developed with vacuum and wave soldering

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 2091-2095

  Ko, Young Ki ^a   Fujii, Hiromichi T ^b   Sato, Yutaka S ^b   Lee, Chang Woo ^a   Yoo, Sehoon ^a  

^a Korea Institute of Industrial Technology   (South Korea)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL METHODS; DEEP REACTIVE ION ETCHING; FILLING TECHNOLOGIES; MOLTEN SOLDERS; PRESSURE DIFFERENCES; THROUGH-SILICON-VIA; VACUUM PRESSURE; VIA HOLE; WAFER THICKNESS; WAVE SOLDERING; WETTING LAYER;

FILLING; GOLD; REACTIVE ION ETCHING; SILICON WAFERS; SURFACE TENSION; TECHNOLOGY; VACUUM;

SOLDERING;

EID: 79960430151     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898806     Document Type: Conference Paper

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