SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 6-10

Study of 15μm pitch solder microbumps for 3D IC integration

(10) Yu, Aibin a Lau, John H b Ho, Soon Wee a Kumar, Aditya a Hnin, Wai Yin a Yu, Da Quan a Jong, Ming Ching a Kripesh, Vaidyanathan a Pinjala, Damaruganath a Kwong, Dim Lee a

a INSTITUTE OF MICROELECTRONICS (Singapore)

b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

3D STACKING TECHNOLOGY; ASSEMBLY PROCESS; BONDING CONDITIONS; CHIP ASSEMBLY; ELECTROLESS; FLIP-CHIP BONDERS; HIGH DENSITY; LOW COSTS; MICRO-BUMPS; SI CHIPS; ULTRA FINE PITCH; UNDER-BUMP METALLURGIES; UNDERFILL MATERIALS; UNDERFILL PROCESS; UNDERFILLING; VOID-FREE;

BONDING; JOINING; NICKEL METALLURGY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; THREE DIMENSIONAL;

TIN;

EID: 70349686526 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2009.5073988 Document Type: Conference Paper

Times cited : (79)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.