Process solutions and polymer materials for 3D-WLP through silicon via filling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1696-1698

  Bouchoucha, M ^a   Chausse, P ^b   Henry, D ^b   Sillon, N ^b  

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3D STACKING; DRY FILM RESIST; LIQUID RESIN; MATERIAL CHARACTERIZATIONS; POLYMER FILLING; POLYMER MATERIALS; PROCESS OPTIMIZATION; PROCESS SOLUTIONS; THERMO-MECHANICAL; THROUGH-SILICON-VIA;

OPTIMIZATION; RESINS; THREE DIMENSIONAL;

POLYMERS;

EID: 77955220203     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490748     Document Type: Conference Paper

References (7)

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