Cu/Sn microbumps interconnect for 3D TSV chip stacking

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 858-863

  Agarwal, Rahul ^a   Zhang, Wenqi ^a   Limaye, Paresh ^a   Labie, Riet ^a   Dimcic, Biljana ^a   Phommahaxay, Alain ^a   Soussan, Philippe ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BONDING INTERFACES; BONDING PROCESS; CHIP STACKING; CLEANING AGENTS; CU-SN INTERMETALLICS; DIE STACKING; FUTURE GENERATIONS; INTEGRATION SCHEME; LOW TEMPERATURES; MICRO-BUMPS; PICK AND PLACE; SOLID METALS; TRANSIENT LIQUID PHASE BONDING;

DIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; METAL CLEANING; PHASE INTERFACES; SILICON WAFERS; THREE DIMENSIONAL; TIN;

WAFER BONDING;

EID: 77955205027     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490698     Document Type: Conference Paper

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