Effect of TSV interposer on the thermal performance of FCBGA package

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 778-786

  Hoe, Yen Yi Germaine ^a   Yue, Tang Gong ^b   Damaruganath, Pinjala ^d   Chong, Chai Tai ^d   Lau, John H ^c   Xiaowu, Zhang ^d   Vaidyanathan, Kripesh ^d  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b United Test and Assembly Center Ltd UTAC   (Singapore)

^c HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPACT MODELING; CONDUCTIVE FILLERS; DETAILED MODELING; EQUIVALENT THERMAL; FCBGA PACKAGES; FINE PITCH; MODELING APPROACH; PLATING THICKNESS; THERMAL PERFORMANCE; THERMAL RESISTANCE; THROUGH-SILICON-VIA;

ELECTRONICS PACKAGING; MIXED CONVECTION; PACKAGING; POWDERS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

FILLED POLYMERS;

EID: 77950959311     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416445     Document Type: Conference Paper

References (7)

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