Novel anisotropic conductive adhesive for 3D stacking and lead-free PCB packaging - A review

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 246-254

  Ramkumar, S Manian ^a   Venugopalan, Hari ^b   Khanna, Kumar ^b  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b SunRay Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D STACKING; ANISOTROPIC CONDUCTIVE ADHESIVES; CHIP STACKING; COMPONENT LEVELS; COMPONENT PACKAGING; CONDUCTIVE ADHESIVE; FLIP CHIP BONDING; HIGH-TEMPERATURE PROCESSING; IDEAL SOLUTIONS; LEAD-BASED SOLDERS; LEAD-FREE; LOW TEMPERATURES; NEW COMPONENTS; PACKAGING TECHNIQUES; PARASITIC INDUCTANCES; PCB ASSEMBLY; PLANARITY; PROCESSING STEPS; PRODUCT MINIATURIZATION; ROHS COMPLIANCE; SENSITIVE COMPONENTS; SUBSTRATE MATERIAL; SYSTEM IN PACKAGE;

ADHESIVES; ANISOTROPY; ASSEMBLY; BONDING; CHIP SCALE PACKAGES; CONDUCTIVE MATERIALS; CONSUMER PRODUCTS; ELECTRONICS INDUSTRY; MINIATURE INSTRUMENTS; PACKAGING; PACKAGING MATERIALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

ADHESIVE JOINTS;

EID: 79960423956     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898521     Document Type: Conference Paper

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